Core Capabilities

Full-chain Advanced Packaging Foundry Service

Focusing on advanced packaging, we provide a full set of process services from precise die handling and redistribution to multi-dimensional heterogeneous integration for high-performance chips in consumer electronics, AR/VR and industrial manufacturing.

Our 3D advanced packaging platform provides chip-level to system-level 3D integration solutions, widely used in AI accelerators, high-bandwidth memory (HBM) integration and edge computing processors. Through silicon interposers or high-density redistribution layers, advanced packaging integrates multiple dies side by side on one substrate for high-density, low-latency, low-power interconnects.

• Low power
• High density
• Low latency
• Efficient transmission
• Vertical stacking
• Optimized thermal management