This year marks the kickoff of the 15th Five-Year Plan. The city is committed to accelerating the development of a national central city, fully building the "Five Centers" and constructing a modernized Wuhan, striving for a strong start to the year. During the New Year's Day holiday, reporters from the Changjiang Daily visited a number of major projects in Wuhan covering technological innovation, advanced manufacturing and people's livelihood security. The bustling construction and production sites fully demonstrate the vibrant momentum of high-quality development in Wuhan. 

On January 2, reporters from the Changjiang Daily witnessed a bustling construction scene at the Phase II project site of the Comprehensive Advanced Packaging Experimental Platform on Guanggu No.1 Road, East Lake High-Tech Development Zone of Wuhan. Tower cranes swung back and forth, while over a hundred construction workers worked on the front lines. Amid the roar of machinery, a brand-new semiconductor clean workshop is taking shape. Targeting a strong start to the year, the project team has formulated a reversed construction schedule and implemented visual progress management, striving to complete the capping of the main workshop before the Lunar Spring Festival and launch the production line by the end of September 2026.

As chip manufacturing processes approach physical limits, advanced packaging has become a pivotal track for the development of the integrated circuit industry in the Post-Moore Era. As the primary builder and operator of the project, Hubei Yangtze Laboratory (HYL) stands as a key innovation player in this critical field. Since its inauguration in 2021, the laboratory has focused on advanced packaging and built the country’s first 12-inch comprehensive advanced packaging experimental platform (Phase I). It has supported nearly 30 types of high-performance chips to complete pilot tape-outs, with its core capabilities reaching world-leading standards.

Yang Daohong, Director of Hubei Yangtze Laboratory, explained that advanced packaging serves as the core technology for high-end chips including high-performance computing chips, silicon photonic chips and integrated sensing, storage and computing chips. It will not only shore up weaknesses in Wuhan’s integrated circuit industrial chain, but also drive a leap in the overall industrial scale. The fast-tracked Phase II project will build a domestic mass production line for advanced packaging of high-end chips, facilitate the direct industrial transformation of pilot test achievements, and form a full-chain innovation loop covering basic research, concept verification, research and development, small-scale trials, pilot tests and industrialization.

In the future, the project will coordinate with innovation platforms for artificial intelligence chips and optical chips, and is expected to attract more than 100 upstream and downstream teams to settle in Optics Valley within a decade. In addition, the construction preparation for the Yangtze Laboratory Industrial Park, adjacent to Jiulonghu, the ecological green core of Future Science and Technology City, is entering its final sprint stage. This series of layouts will further strengthen Wuhan’s capacity as an innovation source and industrialization hub for advanced packaging of integrated circuits, helping Wuhan accelerate its march toward a "World Capital of Storage" during the 15th Five-Year Plan period.