Changjiang Daily News (Reporter Li Qin, Correspondent Xu Gangzhou) At around 9 a.m. on June 30, amid drizzling rain along Guanggu 1st Road, East Lake HighTech Development Zone of Wuhan, a brief and efficient equipment move-in ceremony was successfully concluded in merely over ten minutes. On the same day, the first batch of core process equipment for the pilot line of Hubei Hsingchen Technology Co., Ltd. (hereinafter referred to as HCT) was delivered to site, marking that the Advanced Packaging Pilot Platform with a total investment of RMB 4.58 billion entered the installation and commissioning phase ahead of production launch.

“It only took us nine months from piling work to equipment move-in, a rare feat in the history of semiconductor plant construction,” said Wang Yiqun, General Manager of Hubei Hsingchen Technology Co., Ltd., in an interview with Changjiang Daily reporters at the site. This remarkable speed stems from the team’s maximized schedule compression and highly efficient project execution. As scheduled, equipment will be delivered in batches day by day, and full line operation is expected to be achieved in September this year.

Headquartered in East Lake High-Tech Development Zone, Hubei Hsingchen Technology Co., Ltd. is a state-owned tech enterprise specializing in advanced packaging technologies for integrated circuits. Founded in August 2021 by Hubei Yangtze Laboratory, the company undertakes the core function of industrializing the laboratory’s research outcomes.

As chip manufacturing processes approach physical limits, advanced packaging has emerged as a critical track in the "post-Moore’s Law era". The Hubei Hsingchen Technology Co., Ltd. pilot platform represents Wuhan’s major strategic layout in this field. The project is equipped with a high-standard clean room covering 9,700 square meters. It provides one-stop solutions for interconnection integration pilot testing and risk mass production targeting chips for high-performance AI computing power, smart terminals, sensing-memory-computing integration, optoelectronic integration and other applications.

Wang Yiqun stated that upon the full completion of the production line, it will support the pilot test and risk production of 40 to 50 types of chips simultaneously, as well as the performance verification of 30 to 40 sets of domestically-produced semiconductor equipment and materials. The facility will substantially shorten the cycle for translating high-end intelligent computing chips from research and development to mass production, and accelerate the development of China’s indigenous technology system for system-in-package. The annual revenue generated by the project’s R&D and foundry services is projected to reach RMB 2.7 billion.

Looking ahead, a broader industrial ecosystem network is taking shape. Hubei Hsingchen Technology Co., Ltd.  will collaborate with Wuhan Optics Valley’s industrial bases for AI chips and optical chips to build an integrated regional chip industrial ecosystem. The project targets to attract more than 50 upstream and downstream tech innovation enterprises to settle in Wuhan within a decade, driving the regional output value of advanced packaging to exceed RMB 50 billion.