Responsibilities:

1. Integrate and optimize 2.5D/3D advanced packaging process flows.
2. Lead yield analysis and process window evaluation and drive cross-module problem closure.
3. Interface with customers on technical requirements and deliver process proposals and verification reports.

Requirements:

1. Master's degree or above in microelectronics, physics, materials, chemistry or related.
2. Familiar with advanced packaging process flows; experience in integration or process engineering.
3. Strong data analysis and project management skills.