Responsibilities:

1. Develop thin-film deposition processes (PVD/CVD/ALD), tune parameters and transfer them to mass production.
2. Monitor process stability on the line, analyze and resolve process deviations, and continuously improve yield.
3. Work with equipment, integration and product teams to validate and launch new processes and materials.

Requirements:

1. Master's degree or above in materials, chemistry, mechanical, electrical, automation, environmental engineering, HVAC & power, electronics or related.
2. Experience in semiconductor or advanced packaging processes; familiar with thin-film principles and equipment.
3. Strong problem analysis and cross-functional communication skills.